september 2011 doc id 14996 rev 2 1/9 9 sma6f high junction temperature transil? features ecopack ? 2 compliant product peak pulse power: ? 600 w (10/1000 s) ? 4 kw (8/20 s) stand off voltage: 5, 12 or 13 v unidirectional type low clamping voltage versus standard series low leakage current, 0.2 a at 25 c operating t j max: 175 c jedec registered package outline complies with the following standards iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883g-method 3015-7: class3b ? 25 kv (human body model) description the sma6f transil series has been designed to protect sensitive equipment against electro-static discharges according to iec 61000-4-2, mil std 883 method 3015, and electrical over stress such as iec 61000-4-4 and 5. they are generally for surges below 600 w 10/1000 s. this planar technology ma kes it compatible with high-end equipment and smps where low leakage current and high junction temperature are required to provide relia bility and stability over time. their low clamping voltages provides a better safety margin to protect sensitive circuits with extended life time expectancy. packaged in smaflat non exposed pad, this minimizes pcb space consumption (footprint in accordance with ipc 7531 standard). tm: transil is a trademark of stmicroelectronics k a unidirectional smaflat www.st.com
characteristics sma6f 2/9 doc id 14996 rev 2 1 characteristics table 1. absolute ratings (t amb = 25 c) symbol parameter value unit p pp peak pulse power dissipation (1) t j initial = t amb 600 w p power dissipation on infinite heatsink t lead = 55 c 6 w i fsm non repetitive surge peak forward current for unidirectional types t p = 10 ms t j initial = t amb 60 a t stg storage temperature range -65 to +175 c t j operating junction temperature range -55 to +175 c t l maximum lead temperature for soldering during 10 s 260 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit. table 2. thermal resistance symbol parameter value unit r th (j-l) junction to leads 20 c/w table 3. electrical characteristics - definitions (t amb = 25 c) symbol parameter v rm stand-off voltage v br breakdown voltage v cl clamping voltage i rm leakage current @ v rm i pp peak pulse current t voltage temperature coefficient v f forward voltage drop r d dynamic resistance v cl v br v rm i rm i r i pp v i i f v f v cl v br v rm i rm i r i pp v i i f v f
sma6f characteristics doc id 14996 rev 2 3/9 figure 1. definition of i pp pulse table 4. electrical characteristics - values (t amb = 25 c) type i rm max@v rm v br @i r (1) v cl @i pp 10/1000 s r d (2) 10/1000 s v cl @i pp 8/20 s r d (2) 8/20 s t (3) 25 c 85 c min typ max max max max a (max) v v ma v a va 10-4/c sma6f5.0a 10 50 5.0 6.40 6.74 7.07 10 9.2 68 0.029 13.4 298 0.021 5.7 SMA6F12AVCL 0.2 1 12 13.2 13.7 14.3 1 18.5 31 0.135 22.9 157 0.055 7.8 sma6f13a 0.2 1 13 14.4 15.2 15.9 1 20.4 29 0.154 23.9 147 0.054 8.3 1. pulse test: t p <50ms. 2. to calculate maximum clamping voltage at othe r surge currents, use the following formula v clmax = r d x i pp + v brmax 3. to calculate v br versus junction temperature, use the following formula: v br @ t j = v br @ 25 c x (1 + t x (t j - 25)) 100 50 %i pp t r t p 0 t repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s) figure 2. relative peak power dissipation versus initial junction temperature figure 3. peak pulse power versus exponential pulse duration (t j initial = 25 c) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 25 50 75 100 125 150 175 200 p pp [t j initial] / p pp [t j initial=25c] initial (c) t j p (kw) pp 0.1 1.0 10.0 100.0 1.0e-03 1.0e-02 1.0e-01 1.0e+00 1.0e+01 t j initial = 25 c t (ms) p
characteristics sma6f 4/9 doc id 14996 rev 2 figure 4. clamping voltage versus peak pulse current (exponential waveform, maximum values) figure 5. junction capacitance versus reverse applied voltage (typical values) i pp (a) 0.1 1.0 10.0 100.0 1000.0 5 10152025 t j initial=25 c sma6f5.0a tp = 8/20 s tp = 10/1000 s SMA6F12AVCL sma6f13a v cl (v) c(pf) 100 1000 10000 1 10 100 f=1 mhz v osc =30 mv rms t j =25 c sma6f5.0a SMA6F12AVCL sma6f13a v (v) r
sma6f characteristics doc id 14996 rev 2 5/9 figure 6. peak forward voltage drop versus peak forward current (typical values) figure 7. relative variation of thermal impedance junction to ambient versus pulse duration figure 8. thermal resistance junction to ambient versus copper surface under each lead figure 9. leakage current versus junction temperature (typical values) i (a) fm 1.0e-02 1.0e-01 1.0e+00 1.0e+01 1.0e+02 0.0 0.5 1.0 1.5 2.0 t j =25 c t j =125 c v (v) fm z th(j-a) /r th(j-a) 0.00 0.01 0.10 1.00 1. 0 e- 03 1. 0 e- 0 21. 0 e- 0 11. 0 e+ 00 1. 0 e+ 0 11. 0 e+ 0 21. 0 e+ 03 on recommended pad layout. printed circuit board, fr4 copper thickness = 35 m copper surface = 1 cm2 t (s) p r th(j-a) (c/w) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 s (cm ) cu 2 printed circuit board, fr4 copper thickness = 35 m i (na) r 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 25 50 75 100 125 150 175 v r =v rm v br =11.7v v br >11.7v t (c) j
ordering information scheme sma6f 6/9 doc id 14996 rev 2 2 ordering information scheme figure 10. ordering information scheme sm a 6f xx a - tr surface mount package surge rating a = smaflat package 6f = 600 w stand off voltage example: 5.0 = 5.0 v type a = unidirectional delivery mode tr = tape and reel
sma6f package information doc id 14996 rev 2 7/9 3 package information case: jedec do-221ac molded plastic over planar junction terminals: solder plated, solderable per mil-std-750, method 2026 polarity: band indicates cathode flammability: epoxy rated ul94v-0 rohs package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 5. smaflat (non exposed pad) dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.95 0.088 0.116 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 l1 0.50 0.019 l2 0.50 0.019 figure 11. smaflat footprint dimensions figure 12. marking information d a l 2x l l2 2x l1 2x e e1 b c 1.20 (0.047) 1.20 (0.047) 3.12 (0.123) 5.52 (0.217) 1.52 (0.060) millimeters (inches) y w w z x x x ecopack status xxx: marking z: manufacturing location y: year ww: week cathode bar ( unidirectional devices only )
ordering information sma6f 8/9 doc id 14996 rev 2 4 ordering information for the latest information on available order codes see the product pages on www.st.com. 5 revision history rev 2 table 6. ordering information order code marking package weight base qty delivery mode sma6f5.0a-tr sua smaflat 0.035 g 10000 tape and reel SMA6F12AVCL suj sma6f13a-tr sug table 7. document revision history date revision changes 04-sep-2008 1 first issue. 01-sep-2011 2 updated order code in ta b l e 6 .
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